| Place of Origin: | SUZHOU |
|---|---|
| Brand Name: | PHOENIX |
| Certification: | LM80 CE ROHS |
| Model Number: | 2835 |
| Minimum Order Quantity: | 4000PCS |
| Price: | Negotiation |
| Packaging Details: | 4000PCS /ROLL |
| Delivery Time: | 7-10 DAYS |
| Payment Terms: | Western Union, MoneyGram, T/T |
| Supply Ability: | 800KK PER MONTH |
| Name: | SMD LED 2835 | Nput Voltage(V): | 54V |
|---|---|---|---|
| Luminous Flux(lm): | 150-160lm | CCT: | 3000k 4000k 6500k |
| Power: | 20MA | Application: | Bulb Lamp/home Light |
| Warranty(Year): | 2 Years | Working Time (hours): | 20000 |
| Operating Temperature(℃): | -40-85 | Viewing Angle(°):: | 120 |
| High Light: | 54V 20MA LED Light Chip,54V LED Light Chip,54V led chip full spectrum |
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Application Introduction:
A bulb is composed of seven parts, of which the top is the glass cover, which is stuck on the base. There will be a hole on the base. The base is connected with the heat conduction base, the heat conduction base is connected with the radiator, the driving power supply is connected on the lamp cap, and the luminous is the lamp bead.
The highest cost of a bulb can be said to be the driving power supply. Without this driving, the lamp bead will not be on. For the quality of a bulb, the most important thing is the radiator, driving power supply and lamp beads.
2835 54V 20MA High voltage SMD LED CHIP for bulb lamp
Quick details:
| Input Voltage(V): | 54V |
| Warranty(Year): | 2-Year |
| Type: | Smd Led Chip 2835 |
| Lighting solutions service: | Lighting and circuitry design |
| Luminous Efficacy(lm/w): | 160lm/w |
| Lifespan (hours): | 50000 |
| Working Time (hours): | 20000 |
| Chip Material: | INGAN |
| Emitting Color: | 3000K 4000K 6500K |
| Power: | 1W |
| Viewing Angle(°): | 120 Degree |
| Color Rendering Index(Ra): | 80 |
| Packing bag: | 220*240nm |
| Place of Origin: | Suzhou ,jiangsu |
| Application: | LED STRIP |
| Package Type: | Suface Mount Package |
| Forward Current: | 20MA |
| Size: | 2.8*3.5*0.65mm |
| Packing: | 4000 Pcs/Roll |
Product specification:
Package Structure
Absolute Maximum Ratings
| Item | Symbol | Maximum | Unit |
| Power dissipation | PD | 1 | W |
| Continuous forward current | IFmax | 20 | mA |
| Peak forward current (1/10 duty cycle 10ms pulse width) | IFP | 30 | mA |
| Reverse voltage | VR | 5 | V |
| Electrostatic Discharge (HBM) | ESD | 2000 | V |
| Operating temperature range | Topr | -40 to +85 | ℃ |
| Storage temperature range | Tstg | -40 to +85 | ℃ |
| Led yunction temperature | Tj | 125 | ℃ |
Optical/Electrical Characterization:
| Item | Symbol | Condition | Min | Typ | Max | Unit |
| Forward voltage | VF | IF=60mA | 50 | 52 | 54 | V |
| CIE | X,Y |
IF=60mA IF=60mA |
- | X=0.32 | - | |
| - | Y=0.34 | - | ||||
| CCT | IF=60mA | 2700 | 4000 | 6550 | K | |
| Viewing Angle | 2θ1/2 | IF=60mA | - | 120 | - | Deg |
| Luminous Intensity | IV | IF=60mA | 120 | 160 | LM | |
| CRI | RA | IF=60mA | 80 | RA | ||
| Reverse Current | Ir | Vr=5V | 0 | 1 | uA | |
| Thermal resistance | Rth(j-s) | IF=60mA | 28 | ℃/W |
Typical Electro-Optical characteristics curves:
LED Reliability Test List
| No. | Item | Test Conditions |
Test hr/cycle/time |
Sample Q’ty |
Ac∕Re | |
| 1 | Solder Heat | TEMP:260℃±5℃；5±1 sec | 2 times | 30 pcs | 0∕1 | |
| 2 | Solder ability Test ※ | TEMP:235℃±5℃；3±1 sec | 1 time | 5 pcs | 0∕1 | |
| 3 | Temperature Cycle |
H:+100℃ 30min. ∫5min. L:-40℃ 30min. |
100 cycles | 20 pcs | 0∕1 | |
| 4 | Thermal Shock |
H:+100℃ 5min. ∫ L:-40℃ 5min. |
50 cycles | 20 pcs | 0∕1 | |
| 5 | High Temperature Storage | TEMP:100℃ | 1000 hrs | 20 pcs | 0∕1 | |
| 6 | Low Temperature Storage | TEMP:-40℃ | 1000 hrs | 20 pcs | 0∕1 | |
| 7 | DC Operating Life | IF＝IFmax | 1000 hrs | 20 pcs | 0∕1 | |
| 8 |
High Temperature High Humidity |
85℃∕85％R.H. | 1000 hrs | 20 pcs | 0∕1 | |
| 9 | Shocking test |
100～2000Hz ；98.1m/s2 X,Y,Z direction |
2 hrs | 20 pcs | 0∕1 | |
| 10 | Dropping test | Put on pallet ；height:75cm | 3 times | 20 pcs | 0∕1 | |
| Judgment Criteria | ||||||
| Forward Voltage VF | VF Max-Increase < 1.1x | |||||
| Reverse Current IR | IR Max-Increase < IRmax | |||||
| Luminous Intensity IV | IV Decay < 40% | |||||
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※Solder ability test criteria:coverage is not less than 95% Note:Measurement shall be taken after the tested samples have been returned to normal ambient conditions (generally after two hours) |
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Packaging:
Cautions:
The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the
Top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions Should be taken to avoid the strong pressure on the encapsulated part. So when use the picking up nozzle,The pressure on the silicone resin should be proper.
Soldering iron :
When hand soldering, the temperature of the iron must less than 300℃ for 3 seconds
The hand solder should be done only one times
SMT Reflow Soldering Instructions SMT :
Reflow soldering should not be done more than two times
When soldering , do not put stress on the LEDs during heating
The recommended reflow soldering profile as following
Handling Precautions :
Handle the component along the side surface by using forceps or appropriate tools
Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry
Do not stack together assembled PCBs containing LEDs. Impact may scratch the silicone lens or damage the internal circuitry
Product features:
Adopt good quality chip and frame ,antistatic good stability Ultra low attenuation
High brightness ,low attenuation high color rendering
Minimum 70,80,90 95 CRI options
Strong welding and good stability undead light
Product series and company logo on the front
CE ROHS LM80 Certification
Production Process:
